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Thermally
Conductive Compounds
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- P-56A: Mineral filled, thermally conductive
compound with excellent electrical properties.
- P-116: Highly filled thermally conductive system
with high Tg, low shrinkage and low water absorption.
Recommended for high temperature applications.
- P-178: Filled, thermally conductive compound with
good flexibility and thermal shock resistance. Not
recommended for high temperature applications.
| Recommended
Mixing and Handling Parameters |
| Potting
Compound |
P-56A |
P-116 |
|
P-178 |
| Base
Resin |
Epoxy |
Epoxy |
|
Epoxy |
| Compound |
56 |
116 |
|
178 |
| Activator |
BA-22A |
BA-100 |
|
BA-47 |
| Activator
Required, parts by weight per hundred of adhesive |
71 |
14 |
|
6.0 |
| Mixed
Viscosity, poise/°F |
13/160 |
1200/75 |
|
14/160 |
| Work
Life, hr/°F |
0.7/160 |
24/75 |
|
3/160 |
| Recommended
Cure, hr/°F |
8/160 |
3/250
+ 3/350 |
|
16/160 |
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Typical Cured Properties
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| Color |
Black |
Black |
|
Black |
| Specific
Gravity |
2.30 |
2.12 |
|
2.32 |
| Hardness,
Shore D |
90 |
92 |
|
90 |
| Linear
Shrinkage, % |
0.50 |
0.66 |
|
- |
| Water
Absorption (24 hour immersion) at 77°F, % |
0.08 |
0.09 |
|
0.16 |
| Glass
Transition Temperature by DSC, °F |
210
(HDT) |
295 |
|
192 |
| Coefficient
of Thermal Expansion from -65°F to 77°F, 10-6/°F |
18 |
18 |
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- |
| Thermal
Conductivity, Btu-in/ft2-hr-°F |
7.0 |
8.0 |
|
7.1 |
| Flexural
Strength at 77°F, psi |
- |
13,300 |
|
- |
| Flexural
Modulus at 77°F, 106 psi |
- |
1.43 |
|
- |
| Dielectric
Constant at 77°F and 1kHz |
5.76 |
- |
|
6.32 |
| Dissipation
Factor at 77°F and 1kHz |
0.003 |
- |
|
0.006 |
| Volume
Resistivity at 77°F, ohm-cm |
1016 |
- |
|
1015 |
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Click Technical Data Sheet Number
to
receive complete product information
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