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Low Coefficient
of Expansion Compounds
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- P-86: Heat cure system with low exotherm,
suitable for large mass, easily pourable with excellent
dielectric properties.
- P-103: General purpose compound with good shock
resistance to impact and thermal shock.
- P-182: Highly filled high performance system with
low thermal expansion and excellent dimensional stability.
Meets NASA outgassing requirements.
| Recommended
Mixing and Handling Parameters |
| Potting
Compound |
P-86 |
P-103 |
P-182 |
| Compound |
85 |
103 |
182 |
| Activator |
BA-62 |
BA-99 |
BA-182 |
| Activator
Required, parts by weight per hundred of adhesive |
27 |
15 |
8.0 |
| Mixed
Viscosity, poise/°F |
40/75 |
100/75 |
12/160 |
| Work
Life, hr/°F |
16/75 |
2/75 |
1/160 |
| Recommended
Cure, hr/°F |
4/180 |
2/140 |
3/160
+ 16/212 |
| Typical
Cured Properties |
| Color |
Black |
Black |
Black |
| Specific
Gravity |
1.72 |
1.55 |
1.82 |
| Hardness,
Shore D |
90 |
90 |
93 |
| Linear
Shrinkage, % |
0.16 |
0.30 |
0.07 |
| Water
Absorption (24 hour immersion) at 77°F,
% |
0.02 |
0.30 |
0.04 |
| Glass
Transition Temperature by DSC, °F |
165 |
124 |
276 |
| Coefficient
of Thermal Expansion from -65°F to 77°F,
10-6/°F |
18 |
27 |
12 |
| Thermal
Conductivity, Btu-in/ft2-hr-°F |
4
(est) |
4
(est) |
5 |
| Flexural
Strength at 77°F, psi |
12,100 |
17,000 |
24,500 |
| Flexural
Modulus at 77°F, 106 psi |
1.60 |
0.94 |
1.80 |
| Dielectric
Constant at 77°F and 1kHz |
3.91 |
5.01 |
4.65 |
| Dissipation
Factor at 77°F and 1kHz |
0.003 |
0.007 |
0.014 |
| Volume
Resistivity at 77°F, ohm-cm |
1016 |
1015 |
1014 |
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Click Technical Data Sheet Number
to
receive complete product information
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