| Recommended
Mixing and Handling Parameters |
| Potting
Compound |
P-175 |
| Base
Resin |
Epoxy |
| Compound |
175 |
| Activator |
BA-175 |
| Activator
Required, parts by weight per hundred of adhesive |
16.5 |
| Mixed
Viscosity, poise/°F |
35/160 |
| Work
Life, hr/°F |
0.75/160 |
| Recommended
Cure, hr/°F |
8/160
+ 16/250 |
|
Typical Cured Properties
|
| Color |
Black |
| Specific
Gravity |
0.75 |
| Hardness,
Shore D |
75 |
| Linear
Shrinkage, % |
0.25 |
| Water
Absorption (24 hour immersion) at 77°F, % |
0.02 |
| Glass
Transition Temperature by DSC, °F |
277 |
| Coefficient
of Thermal Expansion from -65°F to 77°F, 10-6/°F |
16 |
| Thermal
Conductivity, Btu-in/ft2-hr-°F |
1.4 |
| Flexural
Strength at 77°F, psi |
5500 |
| Flexural
Modulus at 77°F, 106 psi |
0.46 |
| Dielectric
Constant at 77°F and 1kHz |
2.61 |
| Dissipation
Factor at 77°F and 1kHz |
0.013 |
| Volume
Resistivity at 77°F, ohm-cm |
1014 |
|
Click Technical Data Sheet Number
to
receive complete product information
|
|
