Epoxy Potting Compounds
Light Weight Compounds
P-175:
Low density syntactic foam epoxy compound with low dielectric constant and good long term stability.
Product Properties
Thermally Conductive Compounds
P-56A:
Mineral filled, thermally conductive compound with excellent electrical properties.
P-116:
Highly filled thermally conductive system with high Tg, low shrinkage and low water absorption. Recommended for high temperature applications.
P-178:
Filled, thermally conductive compound with good flexibility and thermal shock resistance. Not recommended for high temperature applications.
Product Properties
Silicone Compounds
SC-10:
Mineral filled silicone compound with high thermal conductivity, good thermal stability and excellent electrical properties
SC-17:
Filled silicone compound with similar cured properties as SC-10 except color, hardness and shorter cure time.
Product Properties
Low Coefficient of Expansion Compounds
P-86:
Heat cure system with low exotherm, suitable for large mass, easily pourable with excellent dielectric properties.
P-103:
General purpose compound with good shock resistance to impact and thermal shock.
P-182:
Highly filled high performance system with low thermal expansion and excellent dimensional stability. Meets NASA outgassing requirements.
Product Properties
